Compared to through-hole construction, inspecting SMD construction is a whole other game. Things you thought were small before are almost invisible now, and making sure solder got where it’s supposed to go can be a real chore. Add some ball grid array (BGA) chips into the mix, where the solder joints are not visible by design, and inspection is more a leap of faith than objective proof of results.
This is a companion discussion topic for the original entry at https://hackaday.com/2024/05/01/tiny-prisms-let-you-see-what-lies-beneath-a-bga-chip/